Invention Grant
- Patent Title: Memory module
- Patent Title (中): 内存模块
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Application No.: US11008901Application Date: 2004-12-10
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Publication No.: US07215540B2Publication Date: 2007-05-08
- Inventor: Shih-Hsiung Lien
- Applicant: Shih-Hsiung Lien
- Applicant Address: TW Taipei
- Assignee: Optimum Care International Tech. Inc.
- Current Assignee: Optimum Care International Tech. Inc.
- Current Assignee Address: TW Taipei
- Priority: TW92221731U 20031210
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H05K5/00 ; H05K7/00 ; H05K1/14 ; H01R12/16

Abstract:
A memory module includes a plurality of memory units, an assembling holder and an engaging arrangement. The assembling holder includes an elongated unit housing having at least an elongated receiving slot extended therealong. The engaging arrangement includes a first assembling joint provided at a side edge portion of one of the memory substrates, and a second assembling joint provided at a corresponding side edge portion of an adjacent memory substrate, wherein the first assembling joint is fittedly and detachably engaged with the second assembling joint of the adjacent memory unit to alignedly couple the memory units with each other in an edge to edge manner to inset into the receiving slot of the elongated unit housing.
Public/Granted literature
- US20050146856A1 Memory module Public/Granted day:2005-07-07
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