Invention Grant
- Patent Title: Semiconductor manufacturing apparatus
- Patent Title (中): 半导体制造装置
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Application No.: US11371677Application Date: 2006-03-08
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Publication No.: US07218985B2Publication Date: 2007-05-15
- Inventor: Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
- Applicant: Hidemitsu Naya , Koji Hashimoto , Masamichi Kawano , Rikio Tomiyoshi
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: Hogan & Hartson LLP
- Priority: JP2002-241294 20020822
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A semiconductor manufacturing apparatus includes: a calculation unit having at least one computer for processing semiconductor design information; a control unit for controlling radiation of an electron in accordance with a processing result of the semiconductor design information; a writing unit for radiating an electron in accordance with instructions of the control unit; and at least one storage device. The semiconductor manufacturing apparatus permits a communication between the storage device, the calculation unit, the control unit, and the writing unit. The semiconductor manufacturing apparatus further includes a communication pass through which the storage device can be controlled.
Public/Granted literature
- US20060155414A1 Semiconductor manufacturing apparatus Public/Granted day:2006-07-13
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