发明授权
- 专利标题: Photoreactive hot-melt adhesive composition
- 专利标题(中): 光反应热熔胶组合物
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申请号: US11244960申请日: 2005-10-06
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公开(公告)号: US07220787B2公开(公告)日: 2007-05-22
- 发明人: Kenji Yamauchi , Takashi Shinjo , Takeshi Miyake
- 申请人: Kenji Yamauchi , Takashi Shinjo , Takeshi Miyake
- 申请人地址: JP Osaka
- 专利权人: Sekisui Chemical Co., Ltd.
- 当前专利权人: Sekisui Chemical Co., Ltd.
- 当前专利权人地址: JP Osaka
- 代理机构: Townsend & Banta
- 优先权: JP2001/6563 20010115; JP2001/54576 20010228
- 主分类号: C08F2/46
- IPC分类号: C08F2/46 ; C08F2/50
摘要:
It is an object to provide a photoreactive hot-melt adhesive composition which exhibits high adhesive strength immediately after combination of adherends and excellent bond strength after completion of curing and provides a highly durable bonded laminate.A photoreactive hot-melt adhesive composition containing: (a) a bisphenol F epoxy resin that assumes a solid form at ordinary temperature; (b) at least one compound selected from the group consisting of a compound represented by the following formula (1), a copolymer of tetramethylene oxide and ethylene oxide and a copolymer of tetramethylene oxide and propylene oxide; and (c) a cationic photoinitiator; R1-(OR2)n—OR3 Formula (1) (In the formula, R1 and R3 independently represent any of a hydrogen atom, a glycidyl group, and a monofunctional substituted or unsubstituted hydrocarbon group having 1–8 carbon atoms; R2 represents a bifunctional, substituted or unsubstituted hydrocarbon group having 2–8 carbon atoms; and n is an integer of 2 or larger. In (OR2)n, R2's of OR2's may be all identical to or different from each other).
公开/授权文献
- US20060030635A1 Photoreactive hot-melt adhesive composition 公开/授权日:2006-02-09