发明授权
- 专利标题: Substrate support having heat transfer system
- 专利标题(中): 具有传热系统的基板支架
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申请号: US10421473申请日: 2003-04-22
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公开(公告)号: US07221553B2公开(公告)日: 2007-05-22
- 发明人: Andrew Nguyen , Wing Lau Cheng , Hiroji Hanawa , Semyon L. Kats , Kartik Ramaswamy , Yan Ye , Kwok Manus Wong , Daniel J. Hoffman , Tetsuya Ishikawa , Brian C. Lue
- 申请人: Andrew Nguyen , Wing Lau Cheng , Hiroji Hanawa , Semyon L. Kats , Kartik Ramaswamy , Yan Ye , Kwok Manus Wong , Daniel J. Hoffman , Tetsuya Ishikawa , Brian C. Lue
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Janah & Associates
- 主分类号: H05F3/00
- IPC分类号: H05F3/00
摘要:
A support for a substrate processing chamber has upper and lower walls that are joined by a peripheral sidewall to define a reservoir. A fluid inlet supplies a heat transfer fluid to the reservoir. In one version, a plurality of protrusions extends into the reservoir to perturb the flow of the heat transfer fluid through the reservoir. In another version, the reservoir is an elongated channel having one or more of (i) serpentine convolutions, (ii) integral fins extending into the channel, (iii) a roughened internal surface, or (iv) a changing cross-section. A fluid outlet discharges the heat transfer fluid from the reservoir.
公开/授权文献
- US20040212947A1 Substrate support having heat transfer system 公开/授权日:2004-10-28