Invention Grant
- Patent Title: Method of forming pre-metal dielectric layer
- Patent Title (中): 形成预金属介电层的方法
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Application No.: US11126900Application Date: 2005-05-10
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Publication No.: US07223675B2Publication Date: 2007-05-29
- Inventor: Jae Suk Lee
- Applicant: Jae Suk Lee
- Applicant Address: KR Seoul
- Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee: Dongbu Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agent Andrew D. Fortney
- Priority: KR10-2004-0033006 20040511
- Main IPC: H01L21/425
- IPC: H01L21/425

Abstract:
A method of forming a pre-metal dielectric (PMD) layer is disclosed. In the method, after a nitride liner layer is formed on a substrate having a transistor, a USG layer is deposited thereon and then planarized. Next, ion implantation and annealing are performed for gettering, first in a gate region and then in a non-gate region of the USG layer. The USG layer is generally free from plasma damage and has a good gap-fill capability. Further, ion implantation and annealing after deposition of the USG layer may enhance a gap-fill capability, a gettering capability, and electrical properties of a transistor.
Public/Granted literature
- US20050255681A1 Method of forming pre-metal dielectric layer Public/Granted day:2005-11-17
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