利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US07223807B2 High dielectric resin composition 有权
高介电树脂组合物

High dielectric resin composition
摘要：
An object of the present invention is to provide a resin composition which is capable of manufacturing a high dielectric resin film having high dielectric constant and small dielectric loss tangent. And the present invention provides high dielectric resin composition comprising: a high dielectric filler; and resin; wherein a relative dielectric constant of the high dielectric filler satisfies the following formulae (1) and (2). [(∈T−∈25)/∈25]MAX≦0.03  (1) 40≦∈25≦1000  (2)
摘要（中）：

本发明的目的是提供一种能够制造具有高介电常数和小的介电损耗角正切的高介电性树脂膜的树脂组合物。 并且本发明提供了高介电性树脂组合物，其包括：高介电填料; 和树脂; 其中高介电填料的相对介电常数满足下式（1）和（2）。 <？in-line-formula description =“In-line Formulas”end =“lead”？> [（∈ T <= 0.03（1）<？in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description = “在线公式”end =“lead”？> 40 <= <= 1000（2）<？in-line-formula description =“In-line Formulas”end =“tail” ？>

公开/授权文献
信息查询
Espacenet
0/0