Invention Grant
- Patent Title: Curable resin composition
- Patent Title (中): 可固化树脂组合物
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Application No.: US10748281Application Date: 2003-12-31
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Publication No.: US07223821B2Publication Date: 2007-05-29
- Inventor: Hiroyuki Okuhira , Akihito Kanemasa , Hiroyuki Hosoda
- Applicant: Hiroyuki Okuhira , Akihito Kanemasa , Hiroyuki Hosoda
- Applicant Address: JP Tokyo
- Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee: The Yokohama Rubber Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Connolly, Bove, Lodge & Hutz, LLP
- Priority: JP2003-000459 20030106
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L75/00

Abstract:
To provide a two-pack type curable resin composition capable of securing a sufficient working life and having excellent curing property, in particular, deep curing property. The two-pack type curable resin composition includes: a first liquid containing a silyl group-denatured urethane prepolymer having an isocyanate group and an alkoxysilyl group in one molecule thereof and a weight average molecular weight of 500 or more; and a second liquid containing a curing agent.
Public/Granted literature
- US20040167275A1 Curable resin composition Public/Granted day:2004-08-26
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