Invention Grant
- Patent Title: Resilient contact structures formed and then attached to a substrate
- Patent Title (中): 弹性接触结构形成然后附着到基底上
-
Application No.: US10035633Application Date: 2001-12-28
-
Publication No.: US07225538B2Publication Date: 2007-06-05
- Inventor: Benjamin Niles Eldridge , Gary William Grube , Igor Yan Khandros , Gaetan L. Mathieu
- Applicant: Benjamin Niles Eldridge , Gary William Grube , Igor Yan Khandros , Gaetan L. Mathieu
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agent N. Kenneth Burraston
- Main IPC: H01R43/16
- IPC: H01R43/16
Abstract:
Contact structures exhibiting resilience or compliance are formed. The contact structures may be formed on a sacrificial substrate. The contact structures are attached to an array of electrical connections on a substrate to form a contact assembly. The electrical connections on the substrate may be metallic pads.
Public/Granted literature
- US20020117330A1 Resilient contact structures formed and then attached to a substrate Public/Granted day:2002-08-29
Information query
