Invention Grant
- Patent Title: Resin composition
- Patent Title (中): 树脂组成
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Application No.: US10618068Application Date: 2003-07-14
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Publication No.: US07226717B2Publication Date: 2007-06-05
- Inventor: Ippei Nakamura , Akihiro Endo
- Applicant: Ippei Nakamura , Akihiro Endo
- Applicant Address: JP Tokyo
- Assignee: Fujifilm Corporation
- Current Assignee: Fujifilm Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2002-204418 20020712
- Main IPC: G03C1/00
- IPC: G03C1/00
Abstract:
The present invention relates to a resin composition comprising: an alkali-soluble resin (A); an infrared absorbing agent (B); and a thiol compound (C), wherein a solubility thereof in an alkaline aqueous solution is changed by exposure with a infrared laser ray, and a positive or negative-type image recording layer containing the resin composition.
Public/Granted literature
- US20040014831A1 Resin composition Public/Granted day:2004-01-22
Information query
