发明授权
US07227251B2 Semiconductor device and a memory system including a plurality of IC chips in a common package
有权
半导体器件和包括公共封装中的多个IC芯片的存储器系统
- 专利标题： Semiconductor device and a memory system including a plurality of IC chips in a common package
- 专利标题（中）： 半导体器件和包括公共封装中的多个IC芯片的存储器系统
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申请号： US11114175申请日： 2005-04-26
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公开(公告)号： US07227251B2公开(公告)日： 2007-06-05
- 发明人: Kazuki Sakuma , Masayasu Kawamura , Yasushi Takahashi , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano
- 申请人： Kazuki Sakuma , Masayasu Kawamura , Yasushi Takahashi , Masachika Masuda , Tamaki Wada , Michiaki Sugiyama , Hirotaka Nishizawa , Toshio Sugano
- 申请人地址： JP Tokyo
- 专利权人： Elpida Memory, Inc.
- 当前专利权人： Elpida Memory, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP9-263434 19970929; JP10-140878 19980522; JP10-335351 19981126
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/48 ; G11C8/00
摘要：
A semiconductor device is formed by laminating two semiconductor chips with the rear surfaces thereof provided face to face. Each semiconductor chip is provided with an outer lead for clock enable to which the clock enable signal and chip select signal are individually input. On the occasion of making access to one semiconductor chip, the other semiconductor chip is set to the low power consumption mode by setting the clock enable signal and chip select signal to the non-active condition.
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