A structure for vertically housing an electronic component is disclosed as including a bottom support member and a top support member. The top support member is substantially parallel to the bottom support member. An open space is formed between the top support member and the bottom support member whereby the electronic component may be placed into the open space in a vertical orientation. A ventilating structure is disposed outside of the open space and is capable of channeling air into a middle portion of the electronic component in the open space.