Invention Grant
- Patent Title: Memory system mounted directly on board and associated method
- Patent Title (中): 内存系统直接安装在板上和相关方法上
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Application No.: US10750093Application Date: 2003-12-31
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Publication No.: US07227796B2Publication Date: 2007-06-05
- Inventor: Jung-Bae Lee , Hoe-Ju Chung
- Applicant: Jung-Bae Lee , Hoe-Ju Chung
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Marger Johnson & McCollom, P.C.
- Priority: KR10-2003-0028175 20030502
- Main IPC: G11C5/02
- IPC: G11C5/02

Abstract:
The invention provides an improved memory system that addresses signal degradation due to transmission line effects. The improved memory system includes a first buffer, at least one first memory device coupled to the first buffer, and a plurality of signal traces. The first buffer and memory device are mounted on a motherboard. Likewise, the plurality of signal traces is routed on the motherboard. Doing so eliminates stub loads that cause signal reflection that, in turn, result in signal degradation.
Public/Granted literature
- US20040221186A1 Memory system mounted directly on board and associated method Public/Granted day:2004-11-04
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