Invention Grant
- Patent Title: Fusing assembly having a temperature equalizing device
- Patent Title (中): 具有温度均衡装置的定影组件
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Application No.: US10975680Application Date: 2004-10-28
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Publication No.: US07228098B2Publication Date: 2007-06-05
- Inventor: James A. Herley , Nicholas Kladias , Gerald A. Domoto
- Applicant: James A. Herley , Nicholas Kladias , Gerald A. Domoto
- Applicant Address: US CT Stamford
- Assignee: Xerox Corporation
- Current Assignee: Xerox Corporation
- Current Assignee Address: US CT Stamford
- Agent Tallam I. Nguti
- Main IPC: G03G15/20
- IPC: G03G15/20

Abstract:
A fusing assembly includes (a) a first member having a first edge, a second edge and an end-to-end axis; (b) a second member having a fusing surface forming a fusing nip with the first member, and the fusing nip being located between the first edge and the second edge of each of the first member and the second member; (c) a heating member extending along the end-to-end axis for heating at least one of the first member and the second member to an image marking material fusing temperature; and (d) a temperature equalizing device for equalizing a temperature of the at least one of the first member and the second member, the temperature equalizing device including plural heat conductors, each heat conductor of the plural heat conductors including a first end and a second end, a body portion between the first end and the second end, the body portion being spaced from and out of contact with the fusing surface of the second member with only the first end and the second end discretely contacting the fusing surface, with the first end and the second end being arranged in an overlapping manner, for contacting the at least one of the first member and the second member at a first contact point and at a second contact point respectively for conducting heat from one of the first contact point and the second contact point to the other.
Public/Granted literature
- US20060093412A1 Fusing assembly having a temperature equalizing device Public/Granted day:2006-05-04
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