Invention Grant
- Patent Title: Flexible ring interconnection system
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Application No.: US11139846Application Date: 2005-05-27
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Publication No.: US07229291B2Publication Date: 2007-06-12
- Inventor: Atsuhito Noda , Yasuhiro Ichijo , Shigeyuki Hoshikawa
- Applicant: Atsuhito Noda , Yasuhiro Ichijo , Shigeyuki Hoshikawa
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Thomas D. Paulius
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.
Public/Granted literature
- US20050266702A1 Flexible ring interconnection system Public/Granted day:2005-12-01
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