Invention Grant
- Patent Title: Component mounting apparatus
- Patent Title (中): 组件安装设备
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Application No.: US11431751Application Date: 2006-05-11
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Publication No.: US07231709B2Publication Date: 2007-06-19
- Inventor: Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
- Applicant: Noriaki Yoshida , Takeshi Takeda , Akira Kabeshita
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP8-347593 19961226
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.
Public/Granted literature
- US20060200974A1 Component mounting method Public/Granted day:2006-09-14
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