Invention Grant
- Patent Title: Radiation hardenable adhesive composition containing dispersed natural rubber fine particles
- Patent Title (中): 含有分散天然橡胶细颗粒的辐射硬化粘合剂组合物
-
Application No.: US10491050Application Date: 2003-03-26
-
Publication No.: US07232857B2Publication Date: 2007-06-19
- Inventor: Akira Hirasawa
- Applicant: Akira Hirasawa
- Applicant Address: JP Tokyo
- Assignee: Toppan Forms Co., Ltd.
- Current Assignee: Toppan Forms Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery
- Priority: JP2002-091071 20020328; JP2002-091072 20020328; JP2002-159469 20020531
- International Application: PCT/JP03/03692 WO 20030326
- International Announcement: WO03/083001 WO 20031009
- Main IPC: C08K3/20
- IPC: C08K3/20

Abstract:
An adhesive composition comprising natural rubber based particles uniformly dispersed in a radiation setting compound is cured by radiation to make a pressure-sensitive adhesive layer on a substrate, thereby: sufficient adhesiveness is obtained; different fillers sufficiently charged; drying time after application is short; both overall application and pattern application are readily performed; application can be performed on different substrates; and sufficient adhesive strength between the substrate and the pressure-sensitive adhesive layer can be realizes. This adhesive composition may be manufactured by: mixing aqueous emulsion 31 containing the natural rubber based particles 30 and the radiation setting compound 32; elevating a temperature of the mixture while stirring; removing vaporized water in the aqueous emulsion; and replacing the water as the medium wherein the natural rubber based particles are dispersed with the radiation setting compound.
Public/Granted literature
- US20050080181A1 Radiation hardenable adhesive composition containing dispersed natural rubber fine particles Public/Granted day:2005-04-14
Information query