Invention Grant
- Patent Title: Semiautomatic finger protection device for doors
- Patent Title (中): 半自动手指保护装置的门
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Application No.: US10944867Application Date: 2004-09-21
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Publication No.: US07234202B2Publication Date: 2007-06-26
- Inventor: Kai Yip Li
- Applicant: Kai Yip Li
- Agency: Rabin & Berdo, P.C.
- Priority: CN200410005287 20040720
- Main IPC: E05F5/02
- IPC: E05F5/02

Abstract:
The present discloses a semiautomatic finger protection device, which comprising a bumper positioned between an outer surface of the door and an doorpost when the door is closed, and positioned in a gap on the hinge side of the door when the door is opened; a securing member to position the bumper; and a connecting member having the two ends retractably connected with said bumper and said securing member respectively. The bumper has a flexible wrapping means received in the bumper to extend/retract the connecting member.
Public/Granted literature
- US20060026793A1 Semiautomatic finger protection device for doors Public/Granted day:2006-02-09
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