Invention Grant
- Patent Title: Method and apparatus for evaporative cooling of a cooling fluid
- Patent Title (中): 冷却液的蒸发冷却方法和装置
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Application No.: US11053806Application Date: 2005-02-09
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Publication No.: US07234309B2Publication Date: 2007-06-26
- Inventor: Dae Young Lee , Jin Koo Lim , Hyun Ki Moon
- Applicant: Dae Young Lee , Jin Koo Lim , Hyun Ki Moon
- Applicant Address: KR
- Assignee: Whizen Global Co., Ltd
- Current Assignee: Whizen Global Co., Ltd
- Current Assignee Address: KR
- Priority: KR10-2004-0045559 20040618
- Main IPC: F25D17/06
- IPC: F25D17/06

Abstract:
A method and an apparatus of evaporative cooling for reducing the volume of an evaporative cooler by considerably lowering the temperature of a cooling fluid are disclosed. A first cooling fluid, which comprises most part of the cooling fluid evaporatively cooled by an outside air while passing through an evaporative cooling section after circulating in an apparatus to be cooled, re-circulates in the apparatus to be cooled. A second cooling fluid, which is separated from the cooling fluid after being cooled in the evaporative cooling section, passes through a sensible air-cooling section placed at an outside air inlet. Thereby, the inflow outside air is sensibly cooled. The second cooling fluid, which passes through the sensible cooling section, re-circulates in the evaporative cooling section.
Public/Granted literature
- US20050279115A1 Method and apparatus for evaporative cooling of a cooling fluid Public/Granted day:2005-12-22
Information query
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