Invention Grant
US07235873B2 Protective device for subassemblies and method for producing a protective device
有权
用于组件的保护装置和用于制造保护装置的方法
- Patent Title: Protective device for subassemblies and method for producing a protective device
- Patent Title (中): 用于组件的保护装置和用于制造保护装置的方法
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Application No.: US10210218Application Date: 2002-08-01
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Publication No.: US07235873B2Publication Date: 2007-06-26
- Inventor: Volker Strutz , Uta Gebauer
- Applicant: Volker Strutz , Uta Gebauer
- Applicant Address: DE Munich
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Munich
- Agent Laurence A. Greenberg; Werner H. Stemer; Ralph E. Locher
- Priority: DE10137666 20010801
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01L23/28 ; H01L23/29 ; H01L21/00 ; H01L21/66
Abstract:
A protective device for subassemblies having a substrate and at least one component to be protected which is disposed on the substrate includes at least one covering element for covering a subassembly. An expanded filler material fills at least one given space between the substrate and the covering element and provides protection against mechanical compression. A method of producing a protective device is also provided. An expandable material is applied to the substrate and is expanded after the covering element has been mounted.
Public/Granted literature
- US20030024735A1 Protective device for subassemblies and method for producing a protective device Public/Granted day:2003-02-06
Information query
IPC分类:
