发明授权
US07236362B2 Minimization of cooling air preheat for maximum packaging density 有权
最小化冷却空气预热,最大限度地提高包装密度

  • 专利标题: Minimization of cooling air preheat for maximum packaging density
  • 专利标题(中): 最小化冷却空气预热,最大限度地提高包装密度
  • 申请号: US10992451
    申请日: 2004-11-18
  • 公开(公告)号: US07236362B2
    公开(公告)日: 2007-06-26
  • 发明人: David G. WangP. Keith Muller
  • 申请人: David G. WangP. Keith Muller
  • 申请人地址: US OH Dayton
  • 专利权人: NCR Corporation
  • 当前专利权人: NCR Corporation
  • 当前专利权人地址: US OH Dayton
  • 代理商 Adam Bennett
  • 主分类号: H05K7/20
  • IPC分类号: H05K7/20
Minimization of cooling air preheat for maximum packaging density
摘要:
An electronic hardware cabinet includes a forced-air component positioned to force a stream of air to move through the cabinet and at least two electronic assemblies mounted within the cabinet, each of which includes a heat-generating component. The electronic assemblies are positioned so that a portion of the stream of air is heated by a first one of the heat-generating components and, thereafter, that portion of the stream of air moves toward a second one of the heat-generating components. An airflow diverter is positioned between the electronic assemblies to deflect that portion of the stream of air heated by the first heat-generating component to prevent it from reaching the second heat-generating component.
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