Invention Grant
- Patent Title: Power supply stacked output port structure
- Patent Title (中): 电源堆叠输出端口结构
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Application No.: US11263827Application Date: 2005-11-02
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Publication No.: US07238046B2Publication Date: 2007-07-03
- Inventor: Chin-Wen Chou , Tsun-Te Shih
- Applicant: Chin-Wen Chou , Tsun-Te Shih
- Applicant Address: TW Taipei Hsien
- Assignee: Zippy Technology Corp.
- Current Assignee: Zippy Technology Corp.
- Current Assignee Address: TW Taipei Hsien
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01R13/60
- IPC: H01R13/60

Abstract:
A power supply stacked output port structure installed on a power output end of a power supply to integrate and output transformed DC power of a circuit board in the power supply. The structure includes a base output port which contains a first connector and a second connector that are arranged in a juxtaposed manner. A stacked output port is provided and horizontally located above the base output port that has at least a third connector. The third connector is electrically connected to the circuit board of the power supply through transmission lines. The stacked output port structure thus formed can increase the number of external equipment to be connected. The transmission lines used on the third connector can achieve more stable electric connection.
Public/Granted literature
- US20070099451A1 POWER SUPPLY STACKED OUTPUT PORT STRUCTURE Public/Granted day:2007-05-03
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