Invention Grant
- Patent Title: Reinforced profile
- Patent Title (中): 加强型材
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Application No.: US10801989Application Date: 2004-03-16
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Publication No.: US07241484B2Publication Date: 2007-07-10
- Inventor: Dirk Van Dijk , Johan Albert Schoenmaker
- Applicant: Dirk Van Dijk , Johan Albert Schoenmaker
- Applicant Address: GB St. Peter Port
- Assignee: Tech-Wood International Ltd.
- Current Assignee: Tech-Wood International Ltd.
- Current Assignee Address: GB St. Peter Port
- Agency: Smith, Gambrell & Russell, LLP
- Priority: NL1022946 20030317
- Main IPC: C08K7/00
- IPC: C08K7/00 ; B32B27/04 ; B32B1/00 ; E04C3/30

Abstract:
A method for manufacturing a compound construction element, in an extrusion process wherein a composite material is pressed through an extrusion die, which composite material includes a matrix of thermoplastic synthetic material including wood particles or other, cellulose containing particles in a content on the order of 50% by weight or more, wherein also one or more elongated additional elements are passed through the extrusion die, which additional elements are brought into tight engagement with the composite material, after which the compound element is shaped and preferably cooled in a die.
Public/Granted literature
- US20040219357A1 Reinforced profile Public/Granted day:2004-11-04
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