Invention Grant
US07242515B2 Structure and method for reducing thermal stresses on a torsional hinged device
有权
用于减少扭转铰链装置上的热应力的结构和方法
- Patent Title: Structure and method for reducing thermal stresses on a torsional hinged device
- Patent Title (中): 用于减少扭转铰链装置上的热应力的结构和方法
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Application No.: US11232604Application Date: 2005-09-22
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Publication No.: US07242515B2Publication Date: 2007-07-10
- Inventor: Arthur Monroe Turner , John W. Orcutt , Carter Bruce Simpson
- Applicant: Arthur Monroe Turner , John W. Orcutt , Carter Bruce Simpson
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent William B Kempler; W. James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: G02F1/00
- IPC: G02F1/00
Abstract:
Method and structure for mounting a torsional hinged device, such as a mirror, having a first TCE (thermal coefficient of expansion) on a substrate having a second TCE different than said first TCE. The structure comprising a plurality of compliant support posts between the substrate and the torsional hinged device that deform when the contraction and/or expansion of the torsional hinged device is different than the corresponding contraction and expansion of the substrate.
Public/Granted literature
- US20060132898A1 Structure and method for reducing thermal stresses on a torsional hinged device Public/Granted day:2006-06-22
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