Invention Grant
- Patent Title: Optical interconnection module and method of manufacturing the same
- Patent Title (中): 光互连模块及其制造方法
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Application No.: US11285624Application Date: 2005-11-22
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Publication No.: US07248768B2Publication Date: 2007-07-24
- Inventor: Keum Soo Jeon , Min Su Lee , Sung Ho Kang , Yong Wook Kim , In Su Park
- Applicant: Keum Soo Jeon , Min Su Lee , Sung Ho Kang , Yong Wook Kim , In Su Park
- Applicant Address: KR Seoul
- Assignee: Doosan Corporation
- Current Assignee: Doosan Corporation
- Current Assignee Address: KR Seoul
- Agency: Harness, Dickey & Pierce, PLC
- Priority: KR10-2005-0092541 20050930
- Main IPC: G02B6/26
- IPC: G02B6/26 ; G02B6/42 ; G02B6/36

Abstract:
The present invention relates generally to an optical interconnection module for vertical optical coupling and a method of manufacturing the optical interconnection module. The optical interconnection module includes an optical waveguide. The optical waveguide includes substrate on which electrode pads and a predetermined circuit pattern are formed; a light source unit provided on the substrate and configured to generate an optical signal and emit the signal to an outside; an optical detection unit for receiving the optical signal from the light source unit and converting the optical signal into an electric signal; drive units provided on the substrate and configured to drive the light source unit and the light detection unit in response to electric signals supplied through the electrode pads; and a cladding layer, a core layer layered on the cladding layer, and an elliptical reflecting mirror surface placed on an end of the core layer facing the light source unit.
Public/Granted literature
- US20070077008A1 Optical interconnection module and method of manufacturing the same Public/Granted day:2007-04-05
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