A method for interconnecting two circuit boards includes positioning corresponding shielded land areas on circuit boards, the land areas including conductive core areas and conductive outer areas around the core areas. A block-like signal array is positioned between the first and second circuit boards, the signal array includes shielded conductors with axial and outer conductive elements. A first compressible interface element including a layer of insulating material having a plurality of conductive elements extending through the insulating material layer is postioned intermediate the shielded land area and the signal array. A second compressible interface element is positioned intermediate the shielded land areas on the other circuit board and the other end of the signal array. The two circuit boards are fastened together to compress the respective compressible interface elements between the signal array and the circuit boards for electrically coupling the circuit boards.