Apparatuses are provided which basically comprise a socket which has at least two contiguous passages formed therein which are adapted to receive exposed wire and/or insulated wire. Bonding materials and crimp joints, alone or in combination, are provided to further secure the assemblies. In one embodiment, electrical connection assemblies are provided, which comprise an electrically conductive wire encapsulated by a sheath of insulating material, the insulating sheath having a first end, a first portion of the wire extending beyond the first end of the insulated sheath; and a socket having first and second contiguous passages formed therein, the first passage being of larger diameter than the second passage, the first portion of the wire being disposed in the second passage, the first end of the insulating sheath being disposed in the first passage. In other embodiments, the assemblies further comprise electrically conductive bonding material disposed in the first and second passages. Electrically conductive bonding material can bond the first portion of the wire to the second passage the first end of the insulating sheath to the second passage. Yet other embodiments have at least one crimp joint formed between the socket and either the exposed wire or the insulated wire. For example, a crimp joint can be formed between the first passage and first end of the insulating sheath. Another desirable crimp joint can be formed, alone or in combination with the crimp joint associated with the insulated sheath, between the second passage and the first portion of the wire. Further, in conjunction with one or more crimp joints, conductive bonding materials can also be used with the assemblies as described above. Methods of electrical communications utilizing such devices are also provided.