Invention Grant
- Patent Title: Layer system
- Patent Title (中): 层系统
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Application No.: US10536486Application Date: 2003-10-30
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Publication No.: US07250222B2Publication Date: 2007-07-31
- Inventor: Knut Halberstadt , Werner Stamm
- Applicant: Knut Halberstadt , Werner Stamm
- Applicant Address: DE Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DE Munich
- Priority: EP02026012 20021121
- International Application: PCT/EP03/12095 WO 20031030
- International Announcement: WO2004/045844 WO 20040603
- Main IPC: B32B5/30
- IPC: B32B5/30 ; B32B15/04 ; B32B15/20 ; C23C4/08 ; C23C24/00

Abstract:
A system for bonding layers (1) of different chemical compositions, such as bonding a thermal barrier layer to a metal substrate on a surface of a gas turbine component. A substrate (4) made either of a ceramic material or particularly of a metal super-alloy may be bonded to an outer layer (16) such as a ceramic by means of a fine-grained intermediate layer (7) bonded to the substrate (4), and a coarse-grained layer (10) bonded to the intermediate layer (7) to create a studded surface (9). The fine and coarse layers (7, 10) provide a transition between the substrate (4) and the outer layer (16) for improved bonding between them. The studded surface (9) may provide at least a 20% increase in bonding surface area for the outer layer (16). Additionally, a medium-grained layer (13) may be applied to the studded surface (9) before applying the outer layer(16).
Public/Granted literature
- US20060051608A1 Layer system Public/Granted day:2006-03-09
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