发明授权
- 专利标题: Dual semiconductor die package with reverse lead form
- 专利标题(中): 双重半导体裸片封装,采用反向引线形式
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申请号: US10987697申请日: 2004-11-12
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公开(公告)号: US07250672B2公开(公告)日: 2007-07-31
- 发明人: Mark Pavier , Ajit Dubhashi , Jorge Cerezo , Leigh Cormie , Vijay Bolloju
- 申请人: Mark Pavier , Ajit Dubhashi , Jorge Cerezo , Leigh Cormie , Vijay Bolloju
- 申请人地址: US CA El Segundo
- 专利权人: International Rectifier Corporation
- 当前专利权人: International Rectifier Corporation
- 当前专利权人地址: US CA El Segundo
- 代理机构: Ostrolenk, Faber, Gerb & Soffen, LLP
- 主分类号: H01L23/52
- IPC分类号: H01L23/52
摘要:
A semiconductor package that includes two semiconductor die each disposed on a respective die pad and a large tracking distance interposed between at least two leads of the package for better creepage characteristics.
公开/授权文献
- US20050133902A1 Dual semiconductor die package with reverse lead form 公开/授权日:2005-06-23