发明授权
- 专利标题: Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same
- 专利标题(中): 在散热板的粘合面和头基板的粘合面之间具有粘接剂的热敏头及其制造方法
-
申请号: US11092181申请日: 2005-03-29
-
公开(公告)号: US07250960B2公开(公告)日: 2007-07-31
- 发明人: Tsutomu Takeya , Kazuhiko Nakazawa , Shigeto Yamada , Masaru Sakurai
- 申请人: Tsutomu Takeya , Kazuhiko Nakazawa , Shigeto Yamada , Masaru Sakurai
- 申请人地址: JP Tokyo
- 专利权人: Alps Electric Co., Ltd.
- 当前专利权人: Alps Electric Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Brinks Hofer Gilson & Lione
- 优先权: JP2004-100225 20040330
- 主分类号: B41J2/335
- IPC分类号: B41J2/335
摘要:
A thermal head includes a head substrate having a plurality of heating resistors which generate heat by electrical dissipation, a common electrode connected to one end of each heating resistor, and a plurality of individual electrodes connected to the other ends of the respective heating resistors. The head substrate is disposed on a heat-dissipation plate. A wide-gap stepped portion is disposed in correspondence with at least a location of the head substrate directly below the heating resistors, and increases an interval between an adhesion surface of the head substrate and an adhesion surface of the heat-dissipation plate. A resilient adhesive capable of absorbing thermal strain is interposed between the adhesion surface of the heat-dissipation plate and the adhesion surface of the head substrate in an adhesion plane where the wide-gap stepped portion is disposed.