发明授权
- 专利标题： Electronic component cooling apparatus
- 专利标题（中）： 电子部件冷却装置
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申请号： US10813328申请日： 2004-03-30
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公开(公告)号： US07251137B2公开(公告)日： 2007-07-31
- 发明人: Masayuki Iijima , Masashi Miyazawa , Kouji Ueno
- 申请人： Masayuki Iijima , Masashi Miyazawa , Kouji Ueno
- 申请人地址： JP Tokyo
- 专利权人： Sanyo Denki Co., Ltd.
- 当前专利权人： Sanyo Denki Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Rankin, Hill, Porter & Clark LLP
- 优先权： JP2003-097393 20030331
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H01L23/34 ; F28F7/00
摘要：
An electronic component, cooling apparatus comprises a so-called water-cooled heat sink, a radiator to be cooled by a motor-driven fan, first and second coolant paths for circulating a coolant between the heat sink and the radiator, and a motor-driven pump for giving a moving energy to the coolant. A plurality of engaging pieces of the motor-driven fan and a plurality of engaged portion of the radiator are engaged to connect the motor-driven fan and the radiator.
公开/授权文献
- US20040190250A1 Electronic component cooling apparatus 公开/授权日：2004-09-30