Method for fabricating dual work function metal gates

Invention Grant

US07253049B2 Method for fabricating dual work function metal gates 有权

Title translation: 双功能金属门制造方法

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Patent Title: Method for fabricating dual work function metal gates
Patent Title (中): 双功能金属门制造方法
Application No.: US11017469

Application Date: 2004-12-20
Publication No.: US07253049B2

Publication Date: 2007-08-07
Inventor: Jiong-Ping Lu , Shaofeng Yu , Haowen Bu , Lindsey H. Hall , Mark R. Visokay
Applicant: Jiong-Ping Lu , Shaofeng Yu , Haowen Bu , Lindsey H. Hall , Mark R. Visokay
Applicant Address: US TX Dallas
Assignee: Texas Instruments Incorporated
Current Assignee: Texas Instruments Incorporated
Current Assignee Address: US TX Dallas
Agent Rose Alyssa Keagy; W. James Brady; Frederick J. Telecky, Jr.
Main IPC: H01L21/8238
IPC: H01L21/8238

Method for fabricating dual work function metal gates

Abstract:

A method for making PMOS and NMOS transistors 60, 70 on a semiconductor substrate 20 that includes having a gate protection layer 210 over the gate electrode layer 110 during the formation of source/drain silicides 120. The method may include implanting dopants into a gate polysilicon layer 115 before forming the protection layer 215.

Abstract(Chinese):

一种用于在半导体衬底20上制造PMOS和NMOS晶体管60,70的方法，其包括在源/漏硅化物120形成期间在栅电极层110上方具有栅极保护层210。该方法可以包括在形成保护层215之前将掺杂剂注入到栅极多晶硅层115中。

Public/Granted literature

US20060134844A1 Method for fabricating dual work function metal gates Public/Granted day:2006-06-22

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS