发明授权
- 专利标题： Method for producing chip stacks
- 专利标题（中）： 生产芯片堆栈的方法
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申请号： US11236311申请日： 2005-09-26
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公开(公告)号： US07253530B2公开(公告)日： 2007-08-07
- 发明人: Holger Hubner
- 申请人： Holger Hubner
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dickstein, Shapiro, LLP.
- 优先权： DE10313047 20030324
- 主分类号： H01L23/52
- IPC分类号： H01L23/52 ; H01L23/48 ; H01L29/40
摘要：
A plurality of interconnect layers are produced on a top side of one or two semiconductor chips, and are mutually isolated from one another in each case by insulation layers that are patterned in such a way that an interconnect layer applied as bridge makes contact with the interconnects applied previously.
公开/授权文献
- US20060055051A1 Method for producing chip stacks 公开/授权日：2006-03-16
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