An injection molding apparatus for small pitch molding includes a plurality of mold cavities having a small pitch therebetween. The injection molding apparatus includes a manifold for delivering melt to a sub-manifold. The sub-manifold including at least one upstream manifold plate and a downstream nozzle plate. The upstream manifold plate and/or the nozzle plate includes a heater. At least one unheated nozzle is mounted in the downstream nozzle plate for receiving melt from the sub-manifold and delivering the melt to a mold cavity.