Invention Grant
- Patent Title: Dissecting device
- Patent Title (中): 解剖装置
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Application No.: US10743707Application Date: 2003-12-24
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Publication No.: US07255705B2Publication Date: 2007-08-14
- Inventor: Lih Tao Hsu , Wannhsin Chen , Kuang Ning Chang , Mei Ju Yang , Jinn Fa Wu , Yeou Bin Guu
- Applicant: Lih Tao Hsu , Wannhsin Chen , Kuang Ning Chang , Mei Ju Yang , Jinn Fa Wu , Yeou Bin Guu
- Applicant Address: TW
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW
- Agency: Bacon & Thomas, PLLC
- Priority: TW91137592A 20021227
- Main IPC: A62B17/3213
- IPC: A62B17/3213 ; B26B21/00

Abstract:
A device for dissecting an object, such as a cell colony includes a handle and an incision knife module that can dissociate the colony into several colony pieces. In accordance with features of the invention, users can use this dissecting device to cut an object into several pieces quickly and smoothly at a time.
Public/Granted literature
- US20040138686A1 Dissecting device Public/Granted day:2004-07-15
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