Invention Grant
- Patent Title: Method and apparatus for placing sensors using 3D models
- Patent Title (中): 使用3D模型放置传感器的方法和装置
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Application No.: US10779444Application Date: 2004-02-13
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Publication No.: US07259778B2Publication Date: 2007-08-21
- Inventor: Aydin Arpa , Keith J. Hanna , Supun Samarasekera , Rakesh Kumar , Harpreet Sawhney
- Applicant: Aydin Arpa , Keith J. Hanna , Supun Samarasekera , Rakesh Kumar , Harpreet Sawhney
- Applicant Address: US NY New York
- Assignee: L-3 Communications Corporation
- Current Assignee: L-3 Communications Corporation
- Current Assignee Address: US NY New York
- Agency: Tiajoloff & Kelly
- Main IPC: H04N7/18
- IPC: H04N7/18
Abstract:
Method and apparatus for dynamically placing sensors in a 3D model is provided. Specifically, in one embodiment, the method selects a 3D model and a sensor for placement into the 3D model. The method renders the sensor and the 3D model in accordance with sensor parameters associated with the sensor and parameters desired by a user. In addition, the method determines whether an occlusion to the sensor is present.
Public/Granted literature
- US20050002662A1 Method and apparatus for placing sensors using 3D models Public/Granted day:2005-01-06
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