Invention Grant
- Patent Title: Retaining and grounding clip for adapter module
- Patent Title (中): 适配器模块的固定和接地夹
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Application No.: US11325174Application Date: 2006-01-04
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Publication No.: US07261602B2Publication Date: 2007-08-28
- Inventor: Brian Keith Lloyd
- Applicant: Brian Keith Lloyd
- Applicant Address: US IL Lisle
- Assignee: Molex Incorporated
- Current Assignee: Molex Incorporated
- Current Assignee Address: US IL Lisle
- Agent Thomas D. Paulius
- Main IPC: H01R13/502
- IPC: H01R13/502

Abstract:
An adapter module used to convert optical signals to electrical signals or electrical signals to optical signals utilizing a “C” shaped retaining clip to secure the adapter module housing together. The retaining clips are used in place of screws, rivets or snap fits and provide an easy and simple way to assembled adapter modules. The retaining clips require no additional structure thereby minimizing the overall size of the adapter module.
Public/Granted literature
- US20060178057A1 Retaining and grounding clip for adapter module Public/Granted day:2006-08-10
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