Invention Grant
- Patent Title: Speaker module design
- Patent Title (中): 扬声器模块设计
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Application No.: US10423772Application Date: 2003-04-24
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Publication No.: US07263387B2Publication Date: 2007-08-28
- Inventor: San-Chi Ho , Kar-Chai Luk , Teerada Sirirattanasit
- Applicant: San-Chi Ho , Kar-Chai Luk , Teerada Sirirattanasit
- Applicant Address: TW Tao Yuan
- Assignee: High Tech Computer, Corp.
- Current Assignee: High Tech Computer, Corp.
- Current Assignee Address: TW Tao Yuan
- Agency: J.C. Patents
- Priority: TW92201050U 20030121
- Main IPC: H04M1/00
- IPC: H04M1/00

Abstract:
A speaker module (200) having a speaker unit (210) and a speaker box (220) is provided. The speaker module is mounted in a casing (22) of a hand-held electronic device (20). The speaker box (220) has a wall defining an aperture (222a) receiving the speaker unit therein. The speaker box has a neck section (224) formed by narrowing a peripheral wall of the speaker box. The neck section connects front and rear speaker chambers (222, 226) each of which has a cross-sectional dimension larger than that of the neck section. The speaker module is mounted on a printed circuit board (24) by fitting the neck section in a hole (24a) of the printed circuit board. The speaker unit is mounted in a front wall of the front chamber (222). An antenna module (26) is mounted in the casing behind the speaker module.
Public/Granted literature
- US20040142731A1 Speaker module design Public/Granted day:2004-07-22
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