发明授权
US07264992B2 Removable flash integrated memory module card and method of manufacture
失效
可移动闪存集成内存模块卡及其制造方法
- 专利标题： Removable flash integrated memory module card and method of manufacture
- 专利标题（中）： 可移动闪存集成内存模块卡及其制造方法
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申请号： US10913868申请日： 2004-08-06
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公开(公告)号： US07264992B2公开(公告)日： 2007-09-04
- 发明人: Paul Hsueh , Jim Ni , Sun-Teck See , Kuang-Yu Wang
- 申请人： Paul Hsueh , Jim Ni , Sun-Teck See , Kuang-Yu Wang
- 代理商 Larry D. Johnson
- 主分类号： H01L21/50
- IPC分类号： H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/498
摘要：
A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.
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