Invention Grant
US07264992B2 Removable flash integrated memory module card and method of manufacture
失效
可移动闪存集成内存模块卡及其制造方法
- Patent Title: Removable flash integrated memory module card and method of manufacture
- Patent Title (中): 可移动闪存集成内存模块卡及其制造方法
-
Application No.: US10913868Application Date: 2004-08-06
-
Publication No.: US07264992B2Publication Date: 2007-09-04
- Inventor: Paul Hsueh , Jim Ni , Sun-Teck See , Kuang-Yu Wang
- Applicant: Paul Hsueh , Jim Ni , Sun-Teck See , Kuang-Yu Wang
- Agent Larry D. Johnson
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L21/48 ; H01L21/44 ; H01L23/02 ; H01L23/498
Abstract:
A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing method includes manufacturing of the memory module and utilizing plastic molding techniques for making the card outer body. The method involves preparing the substrate, mounting the components, testing the module, preparing the molding device, and molding the card body.
Public/Granted literature
- US20060030080A1 Removable flash integrated memory module card and method of manufacture Public/Granted day:2006-02-09
Information query
IPC分类:
