Invention Grant
US07265881B2 Method and apparatus for measuring assembly and alignment errors in sensor assemblies
失效
用于测量传感器组件中的组件和对准误差的方法和装置
- Patent Title: Method and apparatus for measuring assembly and alignment errors in sensor assemblies
- Patent Title (中): 用于测量传感器组件中的组件和对准误差的方法和装置
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Application No.: US10326622Application Date: 2002-12-20
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Publication No.: US07265881B2Publication Date: 2007-09-04
- Inventor: Rodney C. Harris , Kurt E. Spears
- Applicant: Rodney C. Harris , Kurt E. Spears
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: H04N1/46
- IPC: H04N1/46 ; H04N1/00

Abstract:
A target, method, and apparatus are disclosed for measuring assembly and alignment errors in scanner sensor assemblies. The sensor assembly comprises at least two sensor segments. The target comprises edges defined by changes in reflectance. At least one vertical edge corresponds to each sensor segment, and can be detected only by its corresponding segment, even when the segments are misaligned to the maximum extent of their placement tolerances. The target may optionally comprise a horizontal edge spanning the sensor segments. The target is scanned, and the resulting digital image is analyzed to detect the apparent locations of the target edges. The apparent edge locations provide sufficient information to locate the sensor segments. The target may optionally be incorporated into a scanner, or into a separate alignment fixture. The analysis may be performed in a scanner, in a fixture, or in a host computer attached to a scanner or a fixture.
Public/Granted literature
- US20040170314A1 Method and apparatus for measuring assembly and alignment errors in sensor assemblies Public/Granted day:2004-09-02
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