发明授权
- 专利标题： Method for laminating electro-mechanical structures
- 专利标题（中）： 机电结构层压方法
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申请号： US10664404申请日： 2003-09-17
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公开(公告)号： US07266867B2公开(公告)日： 2007-09-11
- 发明人: Jun Shen , Cheng Ping Wei , Mark Goranson
- 申请人： Jun Shen , Cheng Ping Wei , Mark Goranson
- 申请人地址： FR
- 专利权人： Schneider Electric Industries SAS
- 当前专利权人： Schneider Electric Industries SAS
- 当前专利权人地址： FR
- 代理机构： Sterne, Kessler, Goldstein & Fox PLLC
- 主分类号： H04R17/00
- IPC分类号： H04R17/00
摘要：
Methods and systems of assembling and making laminated electro-mechanical systems and structures are described. A plurality of structural layers are formed that include at least one structural layer having a movable element formed therein. The plurality of structural layers are stacked and aligned into a stack. Each structural layer in the stack is attached to an adjacent structural layer of the stack.
公开/授权文献
- US20040183633A1 Laminated electro-mechanical systems 公开/授权日：2004-09-23
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