Invention Grant
- Patent Title: Card edge connector having heat-dissipating mechanism
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Application No.: US11501492Application Date: 2006-08-08
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Publication No.: US07267580B2Publication Date: 2007-09-11
- Inventor: Hua-Yin Huang , Wei Yu
- Applicant: Hua-Yin Huang , Wei Yu
- Applicant Address: TW Taipei Hsien
- Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee: Hon Hai Precision Ind. Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agent Wei Te Chung
- Priority: TW94213419U 20050808
- Main IPC: H01R24/00
- IPC: H01R24/00

Abstract:
According to one embodiment of the present invention, a card edge connector (100) includes an elongated insulative housing (1) having a central slot (15) cooperatively enclosed by a bottom wall (150) and a pair of sidewalls thereof (13). A number of conductive terminals (2) are arranged along the central slot for mechanical and electrical engagement with a daughter circuit board (5) coupled thereto. The bottom wall of the housing defines a number of airways (151) in communication with the central slot, so as to dissipate heat generated by the conductive terminals during signal transmission to the outer circumstance timely.
Public/Granted literature
- US20070032117A1 Card edge connector having heat-dissipating mechanism Public/Granted day:2007-02-08
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