发明授权
- 专利标题： Method of making a microstructure using a circuit board
- 专利标题（中）： 使用电路板制造微结构的方法
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申请号： US10670190申请日： 2003-09-26
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公开(公告)号： US07267755B2公开(公告)日： 2007-09-11
- 发明人: Jao-Ching Lin , Pei-Pei Ding
- 申请人： Jao-Ching Lin , Pei-Pei Ding
- 申请人地址： TW Taipei
- 专利权人： Sentelic Corporation
- 当前专利权人： Sentelic Corporation
- 当前专利权人地址： TW Taipei
- 代理机构： Lowe Hauptman Ham & Berner LLP
- 优先权： TW92118325A 20030704
- 主分类号： C25D1/00
- IPC分类号： C25D1/00 ; H05K1/02
摘要：
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
公开/授权文献
- US20050000816A1 Method of making a microstructure using a circuit board 公开/授权日：2005-01-06