Invention Grant
- Patent Title: Compound semiconductor, method for manufacturing the same, semiconductor device, and method for manufacturing the same
- Patent Title (中): 化合物半导体及其制造方法,半导体装置及其制造方法
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Application No.: US10959077Application Date: 2004-10-07
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Publication No.: US07268007B2Publication Date: 2007-09-11
- Inventor: Toshikazu Onishi , Kenichi Inoue
- Applicant: Toshikazu Onishi , Kenichi Inoue
- Applicant Address: JP Osaka
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee: Matsushita Electric Industrial Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2003-352035 20031010
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A first semiconductor layer consisting of AlGaInP is formed on a substrate consisting of GaAs by crystal growth while adding magnesium (Mg) that is a p-type dopant to the first semiconductor layer. A second semiconductor layer consisting of GaAs is then grown on the first semiconductor layer without adding any magnesium to the second semiconductor layer. Thus, the second semiconductor layer can prevent unintended doping (memory effect) produced by magnesium.
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