发明授权
- 专利标题： Card-type circuit device
- 专利标题（中）： 卡式电路装置
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申请号： US10420985申请日： 2003-04-22
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公开(公告)号： US07268417B2公开(公告)日： 2007-09-11
- 发明人: Takao Ochi , Takashi Takata
- 申请人： Takao Ochi , Takashi Takata
- 申请人地址： JP Osaka
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2002-126826 20020426; JP2003-111702 20030416
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/48
摘要：
A electronic circuit device is provided with an electronic component provided with an electrode, a substrate having an upper surface on which the electronic component is mounted, external electrode that is formed near the electronic component mounted on the upper surface of the substrate and that is connected to the electrode, an insulating protrusion that is provided across the upper surface of the external electrode, and a sealing resin that seals the electronic component without covering the external electrode. The upper surface of the external electrode is partitioned by the protrusion into a first area that is located on the sealing resin side and a second area that is located the side opposite to the first area. The adherence of fine particles such as flakes of the sealing resin to the external electrode is suppressed, so that a stable electric connection between the external electrode and the electric equipment can be maintained.
公开/授权文献
- US20030227025A1 Electronic circuit device 公开/授权日：2003-12-11