发明授权
- 专利标题: Thermal paste containment for semiconductor modules
- 专利标题(中): 用于半导体模块的散热膏容纳
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申请号: US11160997申请日: 2005-07-19
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公开(公告)号: US07268428B2公开(公告)日: 2007-09-11
- 发明人: David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
- 申请人: David L. Edwards , Sushumna Iruvanti , Hilton T. Toy , Wei Zou
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Gibb & Rahman, LLC
- 代理商 Joseph Petrokaitis, Esq.
- 主分类号: H01L23/34
- IPC分类号: H01L23/34
摘要:
A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.
公开/授权文献
- US20070045819A1 THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES 公开/授权日:2007-03-01