发明授权
- 专利标题： Method of structuring of a substrate
- 专利标题（中）： 基底结构的方法
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申请号： US10707288申请日： 2003-12-03
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公开(公告)号： US07270940B2公开(公告)日： 2007-09-18
- 发明人: Rainer Klaus Krause , Markus Schmidt
- 申请人： Rainer Klaus Krause , Markus Schmidt
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Ira D. Blecker
- 优先权： EP02102797 20021218
- 主分类号： G03F7/00
- IPC分类号： G03F7/00 ; G03F7/004
摘要：
The invention relates to a method of structuring of a substrate by providing a polymerization starter layer on the substrate, applying a radiation field on the polymerization starter layer for selectively reducing a density of polymerization starters of the polymerization starter layer, applying monomers and then polymerizing of the monomers, the polymerization being initiated by the starters of the polymerization starter layer, and structuring the substrate using the polymerized monomers as a mask.
公开/授权文献
- US20040121527A1 A Method Of Structuring Of A Substrate 公开/授权日：2004-06-24
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