发明授权
- 专利标题: Integrated circuit package system with adhesive restraint
- 专利标题(中): 具有粘合约束的集成电路封装系统
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申请号: US11162682申请日: 2005-09-19
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公开(公告)号: US07274089B2公开(公告)日: 2007-09-25
- 发明人: Jeffrey D. Punzalan , Il Kwon Shim , Zigmund Ramirez Camacho , Henry D. Bathan
- 申请人: Jeffrey D. Punzalan , Il Kwon Shim , Zigmund Ramirez Camacho , Henry D. Bathan
- 申请人地址: SG Singapore
- 专利权人: Stats Chippac Ltd.
- 当前专利权人: Stats Chippac Ltd.
- 当前专利权人地址: SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号: H01L23/495
- IPC分类号: H01L23/495
摘要:
An integrated circuit package system including an integrated circuit die and a lead frame with a trenched die pad. The integrated circuit die is mounted to the trenched die pad.