Invention Grant
US07274108B2 Semiconductor chip capable of implementing wire bonding over active circuits
有权
能够在有源电路上实现引线键合的半导体芯片
- Patent Title: Semiconductor chip capable of implementing wire bonding over active circuits
- Patent Title (中): 能够在有源电路上实现引线键合的半导体芯片
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Application No.: US10904540Application Date: 2004-11-15
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Publication No.: US07274108B2Publication Date: 2007-09-25
- Inventor: Bing-Chang Wu
- Applicant: Bing-Chang Wu
- Applicant Address: TW Hsin-Chu
- Assignee: United Microelectronics Corp.
- Current Assignee: United Microelectronics Corp.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A semiconductor chip capable of implementing wire bonding over active circuits (BOAC) is provided. The semiconductor chip includes a bonding pad structure, a metal-metal capacitor formed by at least a pair of metal electrodes on the same plane underneath the bonding pad structure, at least an interconnection metal layer, at least a via plug between the interconnection metal layer and the bonding pad structure, and an active circuit situated underneath the bonding pad structure on a semiconductor bottom.
Public/Granted literature
- US20060103031A1 SEMICONDUCTOR CHIP CAPABLE OF IMPLEMENTING WIRE BONDING OVER ACTIVE CIRCUITS Public/Granted day:2006-05-18
Information query
IPC分类:
