发明授权
- 专利标题： Interconnect for implantable medical device header
- 专利标题（中）： 互连用于可植入医疗器械头
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申请号： US10320044申请日： 2002-12-16
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公开(公告)号： US07274963B2公开(公告)日： 2007-09-25
- 发明人: Scott A. Spadgenske
- 申请人： Scott A. Spadgenske
- 申请人地址： US MN St. Paul
- 专利权人： Cardiac Pacemakers, Inc.
- 当前专利权人： Cardiac Pacemakers, Inc.
- 当前专利权人地址： US MN St. Paul
- 代理机构： Schwegman, Lundberg, & Woessner, P.A.
- 主分类号： A61N1/372
- IPC分类号： A61N1/372
摘要：
A modular header and method of fabricating same for making electrical connection between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connector receptacles within the header in which the header is fabricated using a pre-formed molded header module, together with a set or harness of interconnected flexible conductors incorporated and sealed by an overlayer of medical grade polymer material. The assembled modular header is capable of complete pretesting prior to assembly onto an implantable medical device.
公开/授权文献
- US20040116976A1 Interconnect for implantable medical device header 公开/授权日：2004-06-17
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